Kondo Kazuo (Osaka Pref. Univ.), Takeno Yasuhiko (Global Net Corp.), Oikawa Akira (Sumitomo Bakelite Co.,Ltd.) |
All paper related to electronics are accepted. Papers focus on electrochemical Engineering are appreciated.
Most recent update: 2018-02-12 17:39:01
The keywords that frequently used in this topics code. | Keywords | Number | |
---|---|---|---|
electrodeposition | 3 | ||
Copper | 3 | ||
TEC | 2 | ||
Wire | 1 |
ACKN No. | Title/Author(s) | Keywords | Style |
---|---|---|---|
28 | [Keynote lecture] Characteristics and enterprise of low thermal expansion coefficient copper electrodeposit | Copper Electrodeposition TEC | O |
29 | Rotating ring disk electrode study to detect the acceleration effect of MPS with Chloride | Copper Electrodeposition Acceleration | O |
30 | Low thermal expansion coefficient electrodeposited copper and its contraction mechanism by annealing | Copper electrodeposition TEC | O |
31 | [Invited lecture] Introduction to FO-WLP Technology | electronics Packaging Core Less PCB FO-WLP | O |
42 | [Invited lecture] Recent topics in power device | Energy Power device Wire | O |