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$B$3$NJ,N`$G$h$/;H$o$l(B $B$F$$$k%-!<%o!<%I(B | $B%-!<%o!<%I(B | $B | |
---|---|---|---|
forced diffusion | 2$B7o(B | ||
copper | 2$B7o(B | ||
Electrochemical migration | 2$B7o(B | ||
Random walk model | 1$B7o(B |
$B | $B9V1iBjL\!?H/I=$B%-!<%o!<%I(B | $B | |
---|---|---|---|
18 | $B%P%C%A<0%7%j%3%s%&%(%O@v>t$K$*$1$k?eN.$KBP$9$kD62;GH$N1F6A4Q;!(B | Wet cleaning Magasonic wave Water flow | 4/16 15:33:04 |
55 | $B%;%_%"%G%#%F%#%VK!$K$h$kN>LL%U%l%-%7%V%kG[@~4pHD$N7A@.(B | semi-additive flexible circuit | 4/23 10:02:03 |
95 | $B%"%;%H%K%H%j%k$rE:2C:^$KMQ$$$?F<9&Kd$a$N%a%+%K%:%`$N2rL@(B | Via Filling Electrodeposition Acetonitrile | 4/24 15:25:14 |
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149 | [$BE8K>9V1i(B]$BEE6KH?1~B.EY$r9MN8$7$?6d%$%*%s$N%^%$%0%l!<%7%g%s(B | electrochemical migration forced diffusion electrochemical reaction | 4/25 12:23:12 |
166 | $B9b%"%9%Z%/%H9&$X$N$a$C$-$H?tCMN.BN2r@O(B-2 | electrodeposition copper higher aspect ratio | 4/25 14:36:49 |
190 | Cu$B$a$C$-Kl$h$jH/@8$9$k%N%8%e!<%k$N@O=PMW0x$N8!F$(B | electroplating copper nodule | 4/25 17:11:07 |
234 | $B%l!<%6! | Micropatterning Laser-induced pyrolysis Dielectric thin film | 4/28 09:34:05 |
321 | Tight-Binding Quantum Chemical Molecular Dynamics Study on the Effect of Dopant on Electrical Mechanism of P-type Transparency Conducting Oxide, SrCu2O2 | SrCu2O2 p-type transparency conducting oxide tight-binding quantum chemical dynamics method | 4/28 16:13:39 |
438 | $B9bL)EY | Multi-Layer Bump Interconnection Solder Interconnection | 4/29 15:24:00 |
441 | $B%^%k%A%9%1!<%k%(%l%/%H%m%^%$%0%l!<%7%g%s%7%_%e%l!<%?$N3+H/$H(BCu$BG[@~$X$N1~MQ(B | $BD69bB.2=NL;RJ,;RF0NO3XK!(B $B%-%M%F%#%C%/%b%s%F%+%k%mK!(B $B%(%l%/%H%m%^%$%0%l!<%7%g%s(B | 4/29 15:40:49 |
624 | Electronic and Electrical Properties of Carbon Blacks: An Ultra Accelerated Quantum Chemical Molecular Dynamics Study | molecular electronics carbon black electrical properties | 4/30 14:40:37 |
966 | $B%i%s%@%`%&%)!<%/3H;6%b%G%k$K$h$k%$%*%s$N6/@)3H;6(B | Electrochemical migration Random walk model forced diffusion | 4/30 21:21:08 |